TLDRs;
- LG and Flex sign MOU to develop modular, scalable cooling solutions for AI-intensive data centers.
- The collaboration merges LG’s cooling tech and Flex’s data center infrastructure expertise.
- Details like commercialization timelines and pilot customers remain undisclosed.
- Prefabricated cooling systems could create new opportunities for HVAC and integration partners globally.
LG Electronics has signed a memorandum of understanding (MOU) with U.S.-based data center infrastructure company Flex to co-develop modular cooling systems designed for the next generation of AI data centers.
The initiative addresses one of the industry’s most pressing challenges, managing heat in high-performance computing environments, as artificial intelligence drives explosive demand for data center capacity and energy efficiency.
The two companies will combine their distinct strengths to produce a flexible, preassembled, and pretested cooling solution. LG brings its proven expertise in high-efficiency thermal management systems, including chillers, coolant distribution units (CDUs), and computer room air handlers (CRAHs). Flex contributes decades of experience in data center design, IT systems, and power infrastructure. Together, the partnership aims to set a new benchmark for rapid-deploy cooling systems in the AI infrastructure ecosystem.
Modular Design for Scalability and Efficiency
The planned cooling modules will feature a plug-and-play architecture, allowing operators to add or remove units as needed. This modular approach not only enhances flexibility but also helps optimize energy use and reduce downtime during maintenance or scaling operations.
By using prefabricated, pretested components, both companies aim to simplify deployment, a key benefit for hyperscalers and enterprises expanding AI workloads worldwide. The design enables swift installation on-site, cutting project timelines while minimizing the complexities of traditional large-scale cooling systems.
LG has emphasized that each module can be customized to specific thermal management requirements, ensuring compatibility with various data center configurations and climate conditions. Executives from both firms describe the collaboration as a strategic step toward meeting the surging cooling demands created by advanced AI model training and inference operations.
Missing Deployment Details Raise Questions
Despite the strong technical potential, the announcement leaves critical details open. The MOU does not clarify whether the collaboration will involve direct-to-chip liquid cooling systems, which circulate coolant directly over processors, or focus primarily on air-based CRAH units that cool server rooms more broadly.
Moreover, neither company has disclosed a commercialization timeline or pilot customer, leaving buyers uncertain about when or where the new systems will first be deployed. Industry analysts note that while the MOU highlights ambition, it lacks the kind of deployment evidence typical of mature partnerships.
LG’s ongoing cooling projects across Asia and the Middle East also remain ambiguous, it is unclear whether these existing contracts will integrate the Flex technology or remain independent operations. Without concrete rollout details, the real-world impact of the collaboration will take time to assess.
Boost for Installers and Service Providers
Even so, the shift toward prefabricated cooling modules could unlock fresh opportunities for regional installers, HVAC service firms, and system integrators. As data centers move toward modular infrastructure, third-party companies specializing in thermal system maintenance are likely to benefit from recurring contracts tied to LG’s expansion.
LG’s growth regions, including Indonesia, the Middle East, Africa, and North America, are expected to be key markets for these deployments. Early engagement with LG and Flex could help potential partners position themselves as authorized installation or maintenance providers once commercialization begins.


